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选择性波峰焊(300)

选择性波峰焊(300)

机型特点丨ModelFeatures

●离线机型,需人工放板取板;

●机器集成喷雾与焊接为一体化设计;

●占地空间小,能耗低;

●焊接最大PCB板尺寸:300*300mm

●焊接方式:锡炉Z轴上下动,PCB板移动焊接;

●焊接效率=喷雾时间+焊接时间+人工取放板时间

OMline models require manual placement and retrieval of boards;

Machine integration spray and welding are integrated design;

Small footprint and low energy consumption;

Maximum PCB board size for soldering: 300 * 300mm

Welding method: Move the Z-axis of the tin furnace up and down, and move the PCB board for welding:

Welding cfficiency=spray time+welding time+manual plate removal time

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